Packaging Technologies of Optical Circuits. Semiconductor Optical Switches/Modulators and Their Packaging.

Semiconductor Packaging Assembly Technology

This chapter describes the fundamentals of the processes used by National Semiconductor to assemble IC devices in electronic packages. Electronic packaging provides the interconnection from the IC to the printed circuit board (PCB). Another function is to provide the desired mechanical and environmental protection to ensure reliability and performance. Three fundamental assembly flow processes ...

Evolving and packaging reading technologies

Reading is a fundamental technology for achieving quality software. This paper provides a motivation for reading as a quality improvement technology, based upon experiences in the Software Engineering Laboratory at NASA Goddard Space Flight Center, and shows the evolution of our study of reading via a series of experiments. The experiments range from early reading vs. testing experiments to var...

Fabrication and packaging of integrated chemo-optical sensors

This paper describes the design and fabrication of a sensitive integrated chemo-optical sensor supplied with on-chip fiber-towaveguide connectors. The sensor is designed for TE-polarized light with wavelength of 633 nm. The fiber-to-chip connectors are based on easily fabricated silicon V-grooves combined with a smooth sawcut. The sawcut is defining the channel waveguide endface. The sensor is ...

Technology Advances and Globalization in Electronic and Electro-Optical Packaging

Interconnects and Packaging of Millimeter Wave Circuits

This contribution presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different interconnects and two realized front-ends are demonstrated.